cvedb.io
CVE-2017-18157
HIGH · CVSS 7.8
EPSS exploitation probability: 0%
Published 2019-05-06T23:29:00.440 · Last modified 2026-06-17T01:12:17.547

Summary

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Affected products

qualcomm — mdm9206_firmware

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References

This product uses data from the NVD API but is not endorsed or certified by the NVD. Informational only; not professional security advice.