CVE detail

CVE-2019-10612 — CVE-2019-10612

Published 2020-03-05 · Modified 2026-06-17 · Vendor qualcomm · Product mdm9205_firmware · Source nvd

CRITICAL

severity

CVSS-derived band

9.8

CVSS v3

0–10 scale

0.0090

EPSS probability

exploitation probability, 30d

57.0%

EPSS percentile

percentile vs all CVEs

NOT LISTED

CISA KEV

known exploited catalog

Description

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Remediation

No vendor-published fix data in our corpus for this CVE. Check the references below or the vendor's PSIRT / security advisories page.

References

cvedb.io · NVD · CISA KEV · FIRST EPSS · vendor advisories (CVE Program List v5). Informational only, no warranty — verify every remediation against the vendor advisory before acting on it. This product uses data from the NVD API but is not endorsed or certified by the NVD, CISA, FIRST.org or any vendor named. CVE® is a registered trademark of The MITRE Corporation.