CVE detail

CVE-2019-14093 — CVE-2019-14093

Published 2020-07-30 · Modified 2026-06-17 · Vendor qualcomm · Product apq8009_firmware · Source nvd

HIGH

severity

CVSS-derived band

7.8

CVSS v3

0–10 scale

0.0020

EPSS probability

exploitation probability, 30d

10.0%

EPSS percentile

percentile vs all CVEs

NOT LISTED

CISA KEV

known exploited catalog

Description

Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20

Remediation

No vendor-published fix data in our corpus for this CVE. Check the references below or the vendor's PSIRT / security advisories page.

References

cvedb.io · NVD · CISA KEV · FIRST EPSS · vendor advisories (CVE Program List v5). Informational only, no warranty — verify every remediation against the vendor advisory before acting on it. This product uses data from the NVD API but is not endorsed or certified by the NVD, CISA, FIRST.org or any vendor named. CVE® is a registered trademark of The MITRE Corporation.