CVE detail
CVE-2024-23360 — CVE-2024-23360
Published 2024-06-03 · Modified 2026-06-17 · Vendor qualcomm · Product fastconnect_6700_firmware · Source nvd
HIGH
severity
CVSS-derived band
0.0009
EPSS probability
exploitation probability, 30d
1.0%
EPSS percentile
percentile vs all CVEs
NOT LISTED
CISA KEV
known exploited catalog
Description
Memory corruption while creating a LPAC client as LPAC engine was allowed to access GPU registers.
Remediation
No vendor-published fix data in our corpus for this CVE. Check the references below or the vendor's PSIRT / security advisories page.
References